Syenta is seeking a hands‑on electrochemist to lead copper electrodeposition development for advanced packaging interconnects. You will diagnose failures, design focused experiments, and turn outcomes into repeatable, scalable recipes.
You’ll work with process and equipment engineers to shape copper deposition in copper damascene and high aspect ratio structures. You will apply kinetic, mass transport, and current distribution insights to improve uniformity and yield, while translating lab
#J-18808-Ljbffr
Senior Copper Electrodeposition Scientist – LEM Packaging in Sydney employer: Syenta
Syenta is an exceptional employer, fostering a collaborative and people-first culture that empowers engineers to take ownership and innovate in the fast-paced world of semiconductor manufacturing. With a focus on professional growth, competitive salary packages, and early-stage equity opportunities, employees are encouraged to thrive while contributing to groundbreaking technology. Located in Australia, Syenta offers a unique chance to be part of a world-class team dedicated to redefining industry standards and achieving high-impact results.
