Syenta is pioneering Localized Electrochemical Manufacturing (LEM) for advanced packaging interconnects. The role focuses on diagnosing failed copper deposits, designing experiments to pinpoint causes, and turning results into repeatable recipes for production-scale plating systems.
You will work with process and equipment engineers to ensure the plating systems meet specifications, improve yield, and scale lab results to manufacturing environments. A hands-on, fast-moving approach is essential.
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Copper Electrodeposition Engineer for Advanced Packaging in Sydney employer: Syenta
Syenta is an exceptional employer, fostering a collaborative and people-first culture that empowers engineers to take ownership and innovate in the fast-paced world of semiconductor manufacturing. With a focus on professional growth, competitive salary packages, and early-stage equity opportunities, employees are encouraged to thrive while contributing to groundbreaking technology. Located in Australia, Syenta offers a unique chance to be part of a world-class team dedicated to redefining industry standards and achieving high-impact results.
